Insiders said last week that Taiwanese chipmaker MediaTek is preparing to launch its new sub-flagship chipset called the Dimensity 7000. It will join the top-of-the-line Dimensity 9000 5G processor launched in mid-November to compete with Qualcomm’s Snapdragon 870 chip. Its key characteristics have already leaked to the web.
According to the authoritative Chinese source Digital Chat Station, MediaTek Dimensity 7000 will be made using a 5-nanometer technological process, and Taiwanese company TSMC will be engaged in its production. The new chip will include an eight-core chipset consisting of four high-performance Cortex-A78 cores clocked at 2.75 GHz and four energy-efficient Cortex-A55 cores clocked at 2 GHz. The integrated graphics accelerator Mali-G510 MC6 will be responsible for graphics processing. One of the features of the new chip will be support for fast charging up to 75W.
Earlier it was reported that testing of Dimensity 7000 has already started. The official announcement of the new chip is expected in December 2021 or January 2022. The first devices on the new platform will hit the market in the first quarter of next year, that is, from January to March. By the way, one of the first manufacturers to release a smartphone based on the Dimensity 7000 chip may be the Chinese brand Redmi. This was recently announced by the head of Redmi Lu Weibing.
