Last week, the Taiwanese ChipMayaker MediaTek introduced his new flagship chipset Dimensity 9000 5G, made using a 4-nanometer technological process. And now the company is preparing for the release of a new subflagman-level processor called MediaTek Dimensity 7000. Its key characteristics have already leaked to the network.
According to the authoritative Chinese insider Digital Chat Station, the MediaTek Dimensity 7000 chipset will be built on the new Arm V9 architecture, as well as Dimensity 9000 SOC. The new processor will be built on the 5-nanometer technological process and the Taiwanese company MediaTek will be engaged in its production. One of the features of the new subflagramal level platform will be the support of rapid charging with a capacity of up to 75 W, which puts it for one level with Qualcomm Snapdragon 870 chips and Snapdragon 888.
According to Insider, MediaTek has already begun to test the dimensity 7000, and therefore the official announcement of the new platform is not far off. In the meantime, we are waiting that in the near future there will be more information about the new chip, including the number of cores and the clock frequencies on which they work, as well as the graphics accelerator model.